868M High Power Radio Module by CC1312R7Issuing time:2022-11-29 14:07 868M High Power Radio Module by CC1312R7 |
| RF Interface | Parameter | Introduce |
| Frequency | 868MHz, 915MHz | Support ISM |
| Output Power | +27dBm | The maximum power 25mW |
| Sensitivity | -112dBm | 50kbps |
| Symbol Rate | 0.3-4000kbps | Software programming control |
| Deviation | +/-10kHz | Antenna interface |
| Distance | 8000m | In clear and open environment, the antenna gain is 3 dBi, the height above the ground is 2.5 meters, and the air speed is 1.2 kbps. |
| Hardware parameters | Value | Remarks |
| Size | 32.8 x 24.6 x 3mm | - |
| Antenna Interface | IPEX, stamp hole | - |
| Communication Interface | UART, SPI | Software programming |
| Package | SMD | - |
| Electrical Parameters | Minimum | Typical | Maximum | Remarks |
| Volt | 1.8V | 3.3V | 3.9V | |
| Emission Current | 800mA | Instantaneous power consumption | ||
| Receiving Current | 10mA | - | ||
| Sleep current | 1uA | Software programming control | ||
| Working Temperature | -30℃ | 75℃ | - |



Test method of N622PA module
Take the supporting base plate of Coral RF as an example:
The bottom board of N622PA is T532AP, which integrates USB to serial chip, led, button, burning port and module card port. As shown in the figure:

N622PA secondary development method:
The CC1312R7 module is stuck on the backplane as shown in the figure, and the IPEX is connected with the antenna. The burning port is connected with xds110 according to the silk screen printing, and then online simulation can be carried out to test the performance of the module.
Module Programming
The schematic diagram of the module base plate can be obtained from our official website.
Please contact us for specific programming information or download it from TI official website www.ti.com.
The SimpleLink™CC1312R7 device is a multiprotocol Sub-1 GHz wireless microcontroller (MCU) supporting IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), MIOTY, Wi-SUN, proprietary systems, including the TI 15.4-Stack (Sub-1 GHz). The device is optimized for low-power wireless communication and advanced sensing in building security systems, HVAC, smart meters, medical, wired networking, portable electronics, home theater & entertainment, and connected peripherals markets. The highlighted features of this device include:
Flexible Sub-1 GHz radio supporting industry standard frequency bands (315 MHz, 433 MHz, 868 MHz, 900 MHz, and more) to meet the industrial needs.
Wide flexibility of protocol stack support in the SimpleLink™ CC13x2 and CC26x2 Software Development Kit (SDK) including complete SimpleLink™ 15.4-Stack (Sub-1 GHz) solution.
Maximum transmit power of +14 dBm at Sub-1 GHz with 24.9 mA current consumption.
Longer battery life wireless applications with low standby current of 0.85 µA and full RAM retention.
Industrial temperature ready with lowest standby current of 11 µA at 105°C.
Advanced sensing with a programmable, autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1-Hz ADC sampling at 1 µA system current.
Low SER (Soft Error Rate) FIT (Failure-in-time) for long operation lifetime with no disruption for industrial markets with always-on SRAM parity against corruption due to potential radiation events.
Dedicated software controlled radio controller (Arm® Cortex®-M0) providing flexible low-power RF transceiver capability to support multiple physical layers and RF standards.
Excellent radio sensitivity (-121 dBm) and robustness (selectivity and blocking) performance for SimpleLink™ long-range mode.
The CC1312R7 device is part of the SimpleLink™ MCU platform, which consists ofWi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub-1 GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.